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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • APC: 500 USD
    • Managing Editor: Ms. Shira. Lu 
    • Abstracting/ Indexing: Inspec (IET), CNKI Google Scholar, EBSCO, Crossref, Ulrich Periodicals Directory, Chemical Abstracts Services (CAS), etc.
    • E-mail: ijet_Editor@126.com
IJET 2025 Vol.17(2): 121-124
DOI: 10.7763/IJET.2025.V17.1313

Research on the Application of EDA Simulation Technology in Integrated Circuit Design

Yadi Lin
Electrical and Computer Engineering, Rutgers, The State University of New Jersey, New Brunswick, NJ 08901, USA.
Email: 1816883604@qq.com (Y.D.L.)

Manuscript received October 20, 2024; accepted December 7, 2024; published May 30, 2025.

Abstract—Network-oriented intelligent lighting system integrated circuit automation design, in accordance with the integrated circuit multi-layer grid, the shortest path wiring structure, the use of Cadence or PSPICE and other EDA (Electronic Design Automation) simulation software, to carry out the digital circuit, analog circuit partition component design, the reasonable setup of bipolar (triple-pole) tube, Resistor, capacitor, inductor location and system parameters, automated scanning and analysis of DC or AC circuit transient current, voltage, signal frequency, based on the bias circuit schematic diagram to make a polyharmony oscillator circuit logic design structure, analog operating temperature rules check and verification, in order to ensure that the integrated circuit emitter, base current or voltage and other parameters in line with the needs of semiconductor design, enhance the Internet of Things intelligent lighting system Overall performance and working safety of IoT intelligent lighting system.

Keywords—Electronic Design Automation (EDA) simulation techniques, integrated circuits, design, applications


Cite: Yadi Lin, "Research on the Application of EDA Simulation Technology in Integrated Circuit Design," International Journal of Engineering and Technology, vol. 17, no. 2, pp. 121-124, 2025.

Copyright © 2025 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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E-mail: ijet_Editor@126.com