doi: 10.7763/IJET.2010.V2.147
Analysis of Influence of Draw Bead Location and Profile in Hemispherical Cup Forming
Murali G.
1
,
,
- 1 School of Mechanical Engineering, SRM University, Chennai 603203, India
- 2 DMI College of Engineering, Chennai 602103, India
- 3 Department of Production Technology, MIT, Anna University, Chennai 600044, India
Abstract
The quality of sheet metal part is secured by the material flow into the die cavity. Drawbeads are often used in sheet metal forming to restrain the sheet from flowing freely into die cavity. In this paper, finite element method was used to optimize the location of a circular and rectangular drawbeads and analyse the strain and thickness variations during the cup drawing process. DYNAFORM and LS-DYNA, a commercially available explicit FEA code were used to model and analyze the forming process respectively. In simulation, a hemispherical cup of diameter 100mm was considered and simulation studies were carried out for all possible locations of drawbead-, and location which gave minimum Vonmises stress and maximum thickness was taken as the optimized location. Experiments were conducted using a die block of 102mm inner diameter and punch of 100mm diameter on cold rolled steel of thickness 1.02mm. Circular drawbead of specific height was made on the binder surface at the optimized location corresponding groove was machined on the die surface and forming of cup was completed. The experiment was repeated with rectangular drawbead also. Strain and thickness variations were measured for the cup drawing process. The results show good agreement between numerical method and experiment. On comparison, rectangular drawbeads restrain the material more than circular drawbead.
Keywords
- Drawbead
- LS-DYNA
- Plastic strain
- Sheet metal forming
How to Cite
Murali G., Gopal M., and Rajadurai A., "Analysis of Influence of Draw Bead Location and Profile in Hemispherical Cup Forming," International Journal of Engineering and Technology, vol. 2, no. 4, pp. 356-360, 2010. https://doi.org/ 10.7763/IJET.2010.V2.147
Copyright & License
Copyright © 2010 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).