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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • Managing Editor: Ms. Jennifer Zeng
    • Abstracting/ Indexing: Inspec (IET), CNKI Google Scholar, EBSCO, ProQuest, Crossref, etc.
    • E-mail: ijet_Editor@126.com
IJET 2010 Vol.2(1): 48-51 ISSN: 1793-8236
DOI: 10.7763/IJET.2010.V2.98

New Modeling Technology for Spiral Inductors for Ultra Wideband Applications

Neeraj Kr. Shukla, Shilpi Birla, and R. K. Singh

Abstract—Spiral Inductor is becoming a crucial element for the increasing demands of the emerging wireless communication designs. Yet, the challenges of modeling spiral inductors for narrow-band applications are increasing along with emerging Ultra-Wideband (UWB) wireless applications. The challenge is to get an accurate model for UWB applications. A characterization using simulation offers more flexibility during the design process of the spirals. This approach also avoids the need for a specific test wafer dedicated to the spirals, a process parameter characterization suffices. As simulation adds predictive nature in the design process, changes can be made more easily to optimize and fine-tune the layout of the spiral for an optimal inductance value and quality factor. This optimization process can even be automated. Parameter studies can reveal sensitivities and insight on how to improve the behavior of the spiral. A simulation-based approach requires an accurate, computationally efficient and user-friendly tool. This paper discusses integrated spiral inductor metrics, key physical design challenges, and current modeling approaches and limitations. It introduced a new EM solver for introduces a new spiral inductor modeling methodology and application example that is well suited to UWB wireless applications.

Index Terms—UWB, EM Solver, Quality Factor, Test wafer.


Cite: Neeraj Kr. Shukla, Shilpi Birla and R. K. Singh, "New Modeling Technology for Spiral Inductors for Ultra Wideband Applications," International Journal of Engineering and Technology vol. 2, no. 1, pp. 48-51, 2010.

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