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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • Managing Editor: Ms. Jennifer Zeng
    • Abstracting/ Indexing: Inspec (IET), CNKI Google Scholar, EBSCO, ProQuest, Crossref, etc.
    • E-mail: ijet_Editor@126.com
Editor-in-chief
IJET 2013 Vol.5(3): 406-412 ISSN: 1793-8236
DOI: 10.7763/IJET.2013.V5.585

Damped Interconnection-Based Mitigation of Seismic Pounding between Adjacent R/C Buildings

S. Sorace and G. Terenzi

Abstract—A representative case study of potential earthquake-induced pounding between adjacent R/C frame buildings with insufficient separation gaps is examined in this paper. The height of the two examined buildings is the same, but their response is affected by considerable torsional pounding effects. An upgraded version of the traditional linear viscoelastic model for the numerical time-history analysis of the dynamic impact problem is proposed and implemented in the finite element model of the buildings. The results of the assessment enquiries carried out in current conditions, and a damped interconnection-based mitigation solution based on the incorporation of pressurized fluid-viscous dissipaters across the inadequate separation gaps, are presented. Evaluations of the benefits provided by the retrofit intervention, and some of its technical installation details, are finally offered.

Index Terms—Damped interconnection, impact models, mitigation strategies, seismic pounding.

S. Sorace is with the Department of Civil Engineering and Architecture, University of Udine, Via delle Scienze 208, 33100 Udine, Italy (e-mail: stefano.sorace@uniud.it).
G. Terenzi is with the Department of Civil and Environmental Engineering, University of Florence, Via di Santa Marta 3, 50139 Florence, Italy (e-mail: terenzi@dicea.unifi.it).

[PDF]

Cite:S. Sorace and G. Terenzi, "Damped Interconnection-Based Mitigation of Seismic Pounding between Adjacent R/C Buildings," International Journal of Engineering and Technology vol. 5, no. 3, pp. 406-412, 2013.

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