Abstract—This paper presents a novel design for the implementation of a patch antenna over a high impedance surface. Due to the growth of the wireless communication market, many applications and communication systems require integrated antennas of small size, low cost, low profile, and with enhanced performance characteristics. Unlike normal conductors, this new surface does not support propagating surface waves, and its image currents are not phase reversed. The geometry is analogous to a corrugated metal surface in which the corrugations have been folded up into lumped circuit elements, and distributed in a two-dimensional lattice.
Index Terms—Corrugated surfaces, high impedance surface, microstrip patch antenna, surface waves.
Vikas kaduskar is with the Electronics Engineering, BVDUCOE, Pune, India (e-mail: vikaskaduskar@gmail.com)
Shantanu Jagdale is with the Department of E & TC VPCOE, Baramati, India (e-mail: shantanujagdale@gmail.com)
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Cite: Vikas kaduskar and Shantanu Jagdale, "Analysis of High Impedance Surface Dimensions on Microstrip Patch Antenna,"
International Journal of Engineering and Technology vol. 4, no. 6, pp.790-793, 2012.
