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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • APC: 500 USD
    • Managing Editor: Ms. Isa Yuan 
    • Abstracting/ Indexing:  CNKI,  Google Scholar, Crossref, EBSCO  etc.
    • E-mail: ijet_Editor@126.com
IJET 2011 Vol.3(4): 384-387
doi: 10.7763/IJET.2011.V3.256

Reversal Mode of Thermally Assisted Magnetization Reversal on Perpendicularly Magnetized Nano-Dot

Budi Purnama 1,2

  • 1 the
  • 2 the Physics Department of Sebelas Maret University, Indonesia

Abstract

In these micro magnetic simulations, a finite-grid approximation was adopted, where a parallelepiped dot with perpendicular anisotropy was discretized into a two-dimensional array of a rectangular numerical grid. The grid size was chosen to be larger than the exchange length. The demagnetization fields are calculated by integrating those from apparent surface magnetic charges on boundary of each grid element. Thermally assisted magnetization reversal, where the switching field is temporally reduced by heating the selected memory cell in the writing process, is considered in this simulation. Switching mode of thermally assisted magnetization reversal has been numerically investigated by solved Landau-Lifshift Gilbert equation for magnetic nano-dot with perpendicular anisotropy. This thermally scheme succeed to decrease reversal field down to hundreds Oe order. An oscilatory minimum field required for aligning magnetization along writing field direction was observed which can be attributed by an exchange length. This information gives the possibility to realize the high density of Magnetic Random Access Memories with small reversal field (up to hundreds Oersted order) in the reading and writing process.

Keywords

  • Perpendicular anisotropy constant
  • threshold field
  • exchange length
256-T729

How to Cite

Copied

Budi Purnama, "Reversal Mode of Thermally Assisted Magnetization Reversal on Perpendicularly Magnetized Nano-Dot," International Journal of Engineering and Technology, vol. 3, no. 4, pp. 384-387, 2011. https://doi.org/ 10.7763/IJET.2011.V3.256

Copyright & License

Copyright © 2011 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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