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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • Executive Editor: Ms.Yoyo Y. Zhou
    • Abstracting/ Indexing: Chemical Abstracts Services (CAS) EBSCO, Google Scholar, Ulrich Periodicals Directory, Crossref, ProQuest, Index CopernicusEI (INSPEC, IET).
    • E-mail: ijet@vip.163.com
Prof. T. Hikmet Karakoc
Anadolu University, Faculty of Aeronautics and Astronautics, Turkey

IJET 2011 Vol.3(3): 323-326 ISSN: 1793-8236
DOI: 10.7763/IJET.2011.V3.246

Ammonium Chloride as Surfactant for Heat Transfer Enhancement in Pool Boiling

A. R. Acharya, A. T. Pise, and I. I. Momin

Abstract—The heat transfer in boiling can be enhanced by adding small amount of additive in fluid. Addition of small amount of additive in the fluid changes the physical behavior of the boiling phenomenon. Surfactant changes thermo-physical properties of the fluid. Experiments on pool boiling were carried in presence of the surfactant in pure water with an aim to enhance heat transfer in pool boiling by addition of surfactants. Ammonium Chloride (NH4Cl) is taken as test surfactant and added separately in water with varying concentration. The results of surfactant NH4Cl up to 2800 ppm in pure water showed the heat transfer enhancement and above this range no enhancement was observed. Also the trend of boiling curves in presence of this surfactant in the water, shifted towards the lower excess temperature side. Kinetics of vapor bubble in pool boiling phenomena for pure water with and without surfactant was observed in terms of bubble nucleation, growth and its departure.

Index Terms—Surfactant, Boiling, Additive, Surface Tension, Bubble behavior, Flow Visualization.

A. R. Acharya, A. T.Pise, I. I. Momin are at Government College of Engineering, Karad (email: aracharya@rediffmail.com).


Cite: A. R. Acharya, A. T. Pise, and I. I. Momin, "Ammonium Chloride as Surfactant for Heat Transfer Enhancement in Pool Boiling," International Journal of Engineering and Technology vol. 3, no. 3, pp. 323-326, 2011.

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