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General Information
Prof. T. Hikmet Karakoc
Anadolu University, Faculty of Aeronautics and Astronautics, Turkey

IJET 2015 Vol.7(5): 386-389 ISSN: 1793-8236
DOI: 10.7763/IJET.2015.V7.824

Possible Assessment of Slope Stability by Using Electrical Resistivity: Comparison of Field and Laboratory Results

Syed B. Syed Osman and Fahad I. Siddiqui
Abstract—The stability of both natural and engineered slopes has always been a major concern of geotechnical engineers especially in recent years where an increasing number of development are encroaching into hillside areas. In tropical regions, soil slope failures due to frequent rainfall are quite common. One of the long term objectives of this whole research is to implement a quick method of assessing the factor of safety (FOS) in slopes by replacing the conventional soil parameters such as cohesion and internal angle of friction with electrical parameters such as resistivity. However, this paper is limited to the preliminary comparison of laboratory results obtained from controlled laboratory soil samples and results obtained from actual field samples. Results from both the laboratory controlled samples and actual field samples shows consistencies in the correlation between friction angle and electrical resistivity while correlations between moisture content and electrical resistivity shows a similar trend of decreasing moisture content with increase of electrical resistivity value.

Index Terms—Electrical resistivity, correlation, shear strength, slope stability.

S. B. Syed Osman is with the Department of Civil Engineering, University Technology Petronas, 31750 Perak, Malaysia (e-mail: sybaharom@petronas.com.my).
F. I. Siddique is currently with the Department of Mining Engineering, Mehran University of E&T, 76062 Mehran, Pakistan (e-mail: fahad_03mn@hotmail.com).


Cite: Syed B. Syed Osman and Fahad I. Siddiqui, "Possible Assessment of Slope Stability by Using Electrical Resistivity: Comparison of Field and Laboratory Results," International Journal of Engineering and Technology vol. 7, no. 5, pp. 386-389, 2015.

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