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General Information
Editor-in-chief
Prof. T. Hikmet Karakoc
Anadolu University, Faculty of Aeronautics and Astronautics, Turkey

IJET 2014 Vol.6(3): 190-193 ISSN: 1793-8236
DOI: 10.7763/IJET.2014.V6.694

Experimental Tests of Composite Material Used for Compression Joints in Thermal Bridge Breaker Systems

Hyung-Joon Kim, Kyung-Suk Choi, and Dong-Hyeon Shin
Abstract—It is important to eliminate thermal bridge for achieving passive and environmental-friendly buildings. Structural members may frequently act as thermal bridges that become a conduit of energy. A thermal bridge breaker (TBB) system is effective to reduce energy transfer between inside and outside of a building. In order to be used for a structural member, the structural capacity of a TBB system should be larger than a demand resulting from external loads. This study concentrated on the development of a TBB system that will be applicable to connection between interior and exterior floors. The developed TBB system consists of anchorage devices and compression joints. The anchorage devices are used to ensure the continuity of reinforcements in inside and outside floors while the compression joints are used to resist compression stress occurring to the TBB system. Significantly high compressive stresses are usually applied to the compression joints since they are designed with relatively small section areas. This study carried out compressive tests of composite material which is developed to be used for compression joints in a TBB system. Based on test results, TBB systems are designed for the application of a typical floor system.

Index Terms—Thermal bridge breakers, compression joints, composite material, compressive tests.

The authors are with the Department of Architectural engineering, University of Seoul, Korea (e-mail: thymos19@gmail.com)

[PDF]

Cite:Hyung-Joon Kim, Kyung-Suk Choi, and Dong-Hyeon Shin, "Experimental Tests of Composite Material Used for Compression Joints in Thermal Bridge Breaker Systems," International Journal of Engineering and Technology vol. 6, no. 3, pp. 190-193, 2014.

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