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General Information
    • ISSN: 1793-8236 (Online)
    • Abbreviated Title Int. J. Eng. Technol.
    • Frequency:  Quarterly 
    • DOI: 10.7763/IJET
    • Managing Editor: Ms. Jennifer Zeng
    • Abstracting/ Indexing: Inspec (IET), CNKI Google Scholar, EBSCO, ProQuest, Crossref, etc.
    • E-mail: ijet_Editor@126.com
Editor-in-chief
IJET 2013 Vol.5(2): 191-194 ISSN: 1793-8236
DOI: 10.7763/IJET.2013.V5.539

A Comparison between Thermal Buckling Solutions of Power-Law, Sigmoid, Exponential FGM Circular Plates

A. R. Khorshidv and M. R. Eslami

Abstract—In this paper, buckling of elastic, circular plates made of functionally graded material subjected to thermal loading have been investigated. Boundary condition of the plate as immovable clamped edge is considered. The material properties of the FG plates except poisson’s ratios are assumed to vary continuously throughout the thickness direction according to the volume fraction of constituents defined by power-law, sigmoid, and exponential function. The Nonlinear equilibrium equations are derived based on the classical plate theory using variational formulations. Linear stability equations are used to obtain the critical buckling of solid FG circular plate under thermal load as uniform temperature rise, linear and nonlinear temperature distribution through the thickness. The effects of P-, S-, E-FGM on buckling of plate are compared. The results are validated with the known data in the literature.

Index Terms—Classical plate theory, thermal buckling, functionally graded material.

A. R. Khorshidvand is with the engineering Faculty, Department of Mechanical Engineering, South Tehran Branch, Islamic Azad University, Tehran, Iran (e-mail: AR_Khorshidvand@azad.ac.ir).
M. R. Eslami is with the Mechanical Engineering Department, Amirkabir University of Technology, Tehran 15914, Iran (e-mail: eslami@aut.ac.ir).

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Cite:A. R. Khorshidv and M. R. Eslami, "A Comparison between Thermal Buckling Solutions of Power-Law, Sigmoid, Exponential FGM Circular Plates," International Journal of Engineering and Technology vol. 5, no. 2, pp. 191-194, 2013.

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